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Acid copper plating brightener formula
Release Date：2017-9-11 Source：xiashundong Views：837
The acid copper plating process is suitable for use as an intermediate coating for decorative plating, for electroplating various lighting, hardware tools and daily necessities. It is also widely used in plastic plating, PCB plating and electroforming. As the bath composition is simple, low cost, high current efficiency, allowing current density, deposition speed, can be very bright and leveling the coating, and very decorative effect in the production of a wide range of applications, especially in the decoration Electroplating, the use of thick copper thin nickel, is an effective way to deal with high nickel prices. To achieve a good effect of acid copper and give full play to its strengths, the key lies in the brightener.
The development of acid copper brightener is the choice of intermediate and compound. Excellent performance brightener should have bright leveling ability, wide light range, the coating stress is small, ductility and toughness is good, stable and less decomposition products, wide operating temperature range, not easy to produce pinhole pits and so on.
Acid copper plating brightener intermediates
Acid copper brightener is generally composed of carrier, brightener, leveling agent, wetting agent composition.
Carrier (dispersant): rapidly adsorbed to all plated surfaces and uniformly suppresses electrodeposition, and the interaction of leveling agent (a) and brightener (b) results in uniform surface brightness.
Carrier in acid copper plating electrolyte, if the addition of brightener alone, the coating of the bright effect is not significant, must also be added to the surfactant in order to obtain a bright and a certain degree of leveling coating. Commonly used are polyethylene glycol, AE (polyamine and ethylene oxide adduct), DAE (fatty amine and ethylene oxide adduct), AEO (fatty amine polyoxyethylene ether), octyl poly Oxyethylene ether (OP series) and so on. In addition to the carrier as a brightener, some also have wetting, disperse dyes, fine grain effect.
Brightener (to reduce low current resistance, to help low-current zone copper growth): bright agent is the main component of organic sulfonate. Commonly used SP (sodium polydipropionate sulfonate), it can be used alone as a brightener, or with other brightener containing -SS-bond in combination, such as BSP (phenyl dithiopropane sulfonate) , HP (sodium thiopropane sulfonate), TPS (sodium dimethyldimethylsulfonate), and the like.
Leveling agent (to inhibit the deposition of convex areas, expanding the control of brightener): leveling agent mostly heterocyclic compounds and dyes. Commonly used dyes are methyl violet, Tibetan bonus, thiazide dyes, triphenylmethane dyes, polymer thio dyes (alkaline yellow), phenazine dyes and so on. The best phenazine dyes are healthy and green B, which have a high leveling ability and a wide range of bright plating. Some heterocyclic compounds can significantly improve the low brightness and filling performance, also known as low-level brightener, such as LEVELLER135Cu (polyethyleneimine propyl sulfonate), EXP2887 (polyamide cross-linked) JHP (cross-linked polyamide aqueous solution), GISS (polyethyleneimine alkyl compound) and the like.
The development of acid copper brightener is the choice of intermediate and compound. Excellent performance brightener should have bright leveling ability, wide light range, the coating stress is small, ductility and toughness is good, stable and less decomposition products, wide operating temperature range, not easy to produce pinhole pits and so on.
Acid copper plating brightener intermediates
Acid copper brightener is generally composed of carrier, brightener, leveling agent, wetting agent composition.
Carrier (dispersant): rapidly adsorbed to all plated surfaces and uniformly suppresses electrodeposition, and the interaction of leveling agent (a) and brightener (b) results in uniform surface brightness.
Carrier in acid copper plating electrolyte, if the addition of brightener alone, the coating of the bright effect is not significant, must also be added to the surfactant in order to obtain a bright and a certain degree of leveling coating. Commonly used are polyethylene glycol, AE (polyamine and ethylene oxide adduct), DAE (fatty amine and ethylene oxide adduct), AEO (fatty amine polyoxyethylene ether), octyl poly Oxyethylene ether (OP series) and so on. In addition to the carrier as a brightener, some also have wetting, disperse dyes, fine grain effect.
Brightener (to reduce low current resistance, to help low-current zone copper growth): bright agent is the main component of organic sulfonate. Commonly used SP (sodium polydipropionate sulfonate), it can be used alone as a brightener, or with other brightener containing -SS-bond in combination, such as BSP (phenyl dithiopropane sulfonate) , HP (sodium thiopropane sulfonate), TPS (sodium dimethyldimethylsulfonate), and the like.
Leveling agent (to inhibit the deposition of convex areas, expanding the control of brightener): leveling agent mostly heterocyclic compounds and dyes. Commonly used dyes are methyl violet, Tibetan bonus, thiazide dyes, triphenylmethane dyes, polymer thio dyes (alkaline yellow), phenazine dyes and so on. The best phenazine dyes are healthy and green B, which have a high leveling ability and a wide range of bright plating. Some heterocyclic compounds can significantly improve the low brightness and filling performance, also known as low-level brightener, such as LEVELLER135Cu (polyethyleneimine propyl sulfonate), EXP2887 (polyamide cross-linked) JHP (cross-linked polyamide aqueous solution), GISS (polyethyleneimine alkyl compound) and the like.